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  • High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
  • High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
  • High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
  • High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
  • High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
  • High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape

High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape

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Gold Member Since 2019

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Rating: 5.0/5
Manufacturer/Factory & Trading Company

Basic Info.

Thickness
0.06/0.12mm
Transport Package
Pallet
Specification
20/30/40/50MM WIDTH
Trademark
MR. FILM
Origin
Guangdong, China
HS Code
39201090
Production Capacity
600000sqm/Year

Product Description

Detail Description  
ItemMaterialColorThicknessWidthLengthTemp. Resistance
Heat Resisting TapePETGold0.08/0.12mm15/20/30/40/50mm
(other width is available)
33/66/100m200-250ºC
Characteristics1. It is thin  2 mil thickness. When you are trying to cram as much as possible into a given space, the low profile and smooth, slick surface help tremendously.
The tape is single sided adhesive, leaves no discernible residue after remove. You can pull the tape off after a year and not worry about having to clean anything else up.
2. The tape's primary uses are in electrical applications such as coil insulation, capacitor and transformer wrapping or insulation, magnetic wire insulation, and in gold leaf masking during wave soldering. It is also used as a very high temperature mask during powder coating applications.With excellent high temperature performance, electrical insulation, chemical resistance, high adhesion and no glue left after tearing.
Applications1.Use for the surface protection of high temperature painting glass, powder spray painting of aluminum alloy, the electroplating and PCB panel plating.
2.Prevent plating solution from infiltrating electronic components, prevent contamination of passive components such as plating solution droplets and steam, and shield terminal pars during soldering the circuit surface.
3.Ensure solder resistance, solvent resistance and sealing during the soldering process when electronic components are packaged on the substrate.

Pictures
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape

High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape
High Temperature Silicone Copper Polyimide Film Adhesive Masking Tape

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